Three Challenges to Address with Vacuum Components in the Semiconductor Industry
Prevent outgassing and fine leaks. This explains how to solve the unique challenges of a vacuum environment through material selection and integrated molding technology, achieving cleanliness and quality stability of the equipment.
Are you struggling with delays in reaching pressure or outgassing in the vacuum chambers and pump components of film formation or etching processes? A unique design is required in a vacuum environment, different from that in the atmosphere. ■ Three Challenges to Address with Vacuum Components Outgassing: Gas released from within or on the surface of materials contaminates the process. Virtual Leak: Gas trapped in gaps from welding or screw joints gradually leaks out, reducing vacuum levels. Cleanability: Fine surface roughness and casting defects (voids) become reservoirs for contaminants. ■ Hinode's Casting Solutions Track Record: We have a proven track record of using aluminum castings such as AC7A in vacuum chambers. Material Optimization: We propose the optimal material based on specifications for surface treatment and other factors. Structural Optimization: By integrating multiple components, we eliminate welding and physically reduce the risk of gas accumulation. Additionally, we optimize thickness and shape through rigidity analysis to suggest lightweight and cost-reducing solutions. Manufacturing Process: Our low-pressure casting process minimizes fine casting defects caused by gas, ensuring vacuum attainment levels and speeds. One-Stop Manufacturing: We provide a one-stop solution from casting to precision machining and distribution. When procuring, first check the "density of the material" and "the presence of joints."
- Company：日之出水道機器 産業機械マーケティング
- Price：Other
